At present, embedded boards are developing towards thinness and miniaturization. They have the higher the requirements for heat dissipation.
In the design of pure electric vehicles, in order to prevent the battery performance of pure electric vehicles from degrading due to temperature rise, the battery must be managed for heat dissipation. A good heat dissipation system can not only effectively improve the environmental adaptability of the vehicle, but also greatly extend the service life of the battery.
Because of the improvement of the performance and power of communication chips, the power density of data centers continues to increase, reducing energy consumption and cost saving has become a major problem, and then heat dissipation has become a core problem to be solved.